Seminar Invitation: Interconnection Technologies for Advanced Electronic Packaging
Prof. C. Robert Kao, Department of Materials Science and Engineering, National Taiwan University
9:00 a.m. on Tuesday, October 31 in 402 Steidle Building
Abstract:
As Moore's Law nears its end and leading-edge nodes become more complex and costly, advanced packaging becomes crucial. Heterogeneous integration and chiplet approaches, allowing the integration of multiple dies within a single package and the potential to combine mature and advanced nodes, represent the future for AI, autonomous riving, and other high-performance computing. Heterogeneous integration of chiplets through advanced packaging technologies enables the ongoing advancements of microelectronics via this 'more than Moore' approach. This talk will discuss the challenges and opportunities in interconnections within advanced packaging and introduce solutions developed by my research group.
Professor C. Robert Kao received his Ph.D. in Materials Science from University of Wisconsin at Madison in 1994. He joined Department of Chemical & Materials Engineering of National Central University in 1995 and was the inaugural director of the Institute of Materials Science & Engineering at National Central University in 2005. In 2006, he relocated to National Taiwan University and became a University Distinguished Professor there. His research interests include electronic, optical, and MEMS packaging with a main thrust on the thermodynamics and kinetics of materials interactions within packages. He has authored over 200 technical papers, five of which are classified as Highly Cited Papers by ISI Essential Science Indicators, and holds 5 ROC patents and 3 US patents. He has been invited speakers in many international conferences. He is a consultant to leading advanced packaging companies, including TSMC, Unimicron, ASE, and SPIL.
Contact: Zi-Kui Liu, prof.zikui.liu@psu.edu, (814) 865 1934